IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS

期刊基本信息

  • 期刊名称:IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
  • 期刊级别: Science Citation Index Expanded (SCIE) Scopus (CiteScore)
  • 期刊ISSN:0278-0070
  • 期刊EISSN:N/A
  • 简称:IEEE T COMPUT AID D
  • 影响因子:2.9
  • 实时影响因子:截止2025年5月19日:2.677
  • 五年影响因子:2.9
  • JCI期刊引文指标:0.69
  • h-index:107
  • 2024-2025自引率:10.30%
  • 期刊官方网站:http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=43
  • 期刊投稿网址:https://mc.manuscriptcentral.com/tcad
  • 是否OA开放访问:No
  • 出版商:Institute of Electrical and Electronics Engineers Inc.

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS

Science Citation Index Expanded (SCIE)Scopus (CiteScore)

期刊介绍

The purpose of this Transactions is to publish papers of interest to individuals in the area of computer-aided design of integrated circuits and systems composed of analog, digital, mixed-signal, optical, or microwave components. The aids include methods, models, algorithms, and man-machine interfaces for system-level, physical and logical design including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, hardware-software co-design and documentation of integrated circuit and system designs of all complexities. Design tools and techniques for evaluating and designing integrated circuits and systems for metrics such as performance, power, reliability, testability, and security are a focus.

投稿要求

  • 通讯方式:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
  • 涉及的研究方向:工程技术-工程:电子与电气
  • 出版国家或地区:UNITED STATES
  • 出版语言:English
  • 年文章数:388
  • PubMed Central (PMC)链接:http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0278-0070%5BISSN%5D
  • 平均录用比例:容易

CITESCORE

CiteScore SJR SNIP CiteScore排名 5.50 0.725 1.339 学科 分区 排名 百分位 大类:Computer Science 小类:Computer Graphics and Computer-Aided Design Q1 32 / 127 75% 大类:Computer Science 小类:Electrical and Electronic Engineering Q2 255 / 970 73% 大类:Computer Science 小类:Software Q2 170 / 490 65%

WOS期刊JCR分区

WOS分区等级:2区

按JIF指标学科分区收录子集JIF分区JIF排名JIF百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURESCIEQ223/60
62.5%
学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONSSCIEQ390/175
48.9%
学科:ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ2161/366
56.1%
按JCI指标学科分区收录子集JCI分区JCI排名JCI百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURESCIEQ228/60
54.17%
学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONSSCIEQ388/175
50%
学科:ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ2146/366
60.25%

期刊分区表预警名单

2025年03月发布的2025版:不在预警名单中

2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2020年12月发布的2020版:不在预警名单中

中科院2025年3月升级版

点击查看中国科学院期刊分区趋势图
大类学科小类学科Top期刊综述期刊
计算机科学 2区3区4区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
计算机:硬件
2区1区3区
COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS
计算机:跨学科应用
4区1区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
1区4区3区

中科院2023年12月旧的升级版

大类学科小类学科Top期刊综述期刊
计算机科学 1区3区2区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
计算机:硬件
2区3区3区
COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS
计算机:跨学科应用
1区1区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
2区2区3区

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