MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

期刊基本信息

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Science Citation Index Expanded (SCIE)Scopus (CiteScore)

期刊介绍

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

期刊语言要求

Language
Please write your text in good English (American or British usage is accepted, but not a mixture of these). Authors who feel their English language manuscript may require editing to eliminate possible grammatical or spelling errors and to conform to correct scientific English may wish to use the English Language Editing service.

投稿要求

  • 通讯方式:ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
  • 涉及的研究方向:工程技术-材料科学:综合
  • 出版国家或地区:ENGLAND
  • 出版语言:English
  • 年文章数:997
  • PubMed Central (PMC)链接:http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001%5BISSN%5D
  • 平均录用比例:约88.33%
    来源Elsevier官网:
    15%

CITESCORE

CiteScore SJR SNIP CiteScore排名 8.40 0.785 1.086 学科 分区 排名 百分位 大类:Physics and Astronomy 小类:Condensed Matter Physics Q1 53 / 443 88% 大类:Physics and Astronomy 小类:Mechanical Engineering Q1 91 / 720 87% 大类:Physics and Astronomy 小类:Mechanics of Materials Q1 60 / 403 85% 大类:Physics and Astronomy 小类:General Materials Science Q1 96 / 460 79%

WOS期刊JCR分区

WOS分区等级:2区

按JIF指标学科分区收录子集JIF分区JIF排名JIF百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ295/366
74.2%
学科:MATERIALS SCIENCE, MULTIDISCIPLINARYSCIEQ2159/460
65.5%
学科:PHYSICS, APPLIEDSCIEQ252/187
72.5%
学科:PHYSICS, CONDENSED MATTERSCIEQ225/79
69%
按JCI指标学科分区收录子集JCI分区JCI排名JCI百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ2120/366
67.35%
学科:MATERIALS SCIENCE, MULTIDISCIPLINARYSCIEQ2143/462
69.16%
学科:PHYSICS, APPLIEDSCIEQ251/187
72.99%
学科:PHYSICS, CONDENSED MATTERSCIEQ119/79
76.58%

期刊分区表预警名单

2025年03月发布的2025版:不在预警名单中

2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2020年12月发布的2020版:不在预警名单中

中科院2025年3月升级版

点击查看中国科学院期刊分区趋势图
大类学科小类学科Top期刊综述期刊
材料科学 2区3区1区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
4区1区2区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区3区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
3区4区3区
PHYSICS, APPLIED
物理:应用
1区4区3区

中科院2023年12月旧的升级版

大类学科小类学科Top期刊综述期刊
工程技术 3区3区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
4区1区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
3区4区3区
PHYSICS, APPLIED
物理:应用
4区4区3区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
3区4区3区

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