期刊介绍
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
期刊语言要求
Language
Please write your text in good English (American or British usage is accepted, but not a mixture of these). Authors who feel their English language manuscript may require editing to eliminate possible grammatical or spelling errors and to conform to correct scientific English may wish to use the English Language Editing service.
投稿要求
CITESCORE
CiteScore SJR SNIP CiteScore排名
8.40 0.785 1.086 学科 分区 排名 百分位
大类:Physics and Astronomy
小类:Condensed Matter Physics Q1 53 / 443 88%
大类:Physics and Astronomy
小类:Mechanical Engineering Q1 91 / 720 87%
大类:Physics and Astronomy
小类:Mechanics of Materials Q1 60 / 403 85%
大类:Physics and Astronomy
小类:General Materials Science Q1 96 / 460 79%
WOS期刊JCR分区
WOS分区等级:
2区| 按JIF指标学科分区 | 收录子集 | JIF分区 | JIF排名 | JIF百分位 |
| 学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 95/366 |
|
| 学科:MATERIALS SCIENCE, MULTIDISCIPLINARY | SCIE | Q2 | 159/460 |
|
| 学科:PHYSICS, APPLIED | SCIE | Q2 | 52/187 |
|
| 学科:PHYSICS, CONDENSED MATTER | SCIE | Q2 | 25/79 |
|
| 按JCI指标学科分区 | 收录子集 | JCI分区 | JCI排名 | JCI百分位 |
| 学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 120/366 |
|
| 学科:MATERIALS SCIENCE, MULTIDISCIPLINARY | SCIE | Q2 | 143/462 |
|
| 学科:PHYSICS, APPLIED | SCIE | Q2 | 51/187 |
|
| 学科:PHYSICS, CONDENSED MATTER | SCIE | Q1 | 19/79 |
|
期刊分区表预警名单
2025年03月发布的2025版:不在预警名单中
2024年02月发布的2024版:不在预警名单中
2023年01月发布的2023版:不在预警名单中
2021年12月发布的2021版:不在预警名单中
2020年12月发布的2020版:不在预警名单中
中科院2025年3月升级版
点击查看中国科学院期刊分区趋势图| 大类学科 | 小类学科 | Top期刊 | 综述期刊 |
|---|
| 材料科学 2区3区1区 | PHYSICS, CONDENSED MATTER 物理:凝聚态物理 | 4区1区2区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区3区3区 | MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合 | 3区4区3区 | PHYSICS, APPLIED 物理:应用 | 1区4区3区 |
| 否 | 否 |
中科院2023年12月旧的升级版
| 大类学科 | 小类学科 | Top期刊 | 综述期刊 |
|---|
| 工程技术 3区3区3区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 4区1区3区 | MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合 | 3区4区3区 | PHYSICS, APPLIED 物理:应用 | 4区4区3区 | PHYSICS, CONDENSED MATTER 物理:凝聚态物理 | 3区4区3区 |
| 否 | 否 |